Product | Included Intel® Thermal Solution (Active Cooling) | Dynatron Q6 Heatsink for Intel LGA1700 |
Action | Select | Select |
Main Specifications | ||
Type | Heatsink and Fan | |
Application | 3U and Up, Workstation | |
Socket | LGA1700 | |
Detailed Specifications | ||
Compatibility | Intel | |
Heatsink Material | Aluminum Fins, 4x Heat Pipes with H.C.C. Technology | |
Fan Speed | At Duty Cycle 0~20%: 1600± 200 RPM At Duty Cycle 50%: 2850±10% RPM At Duty Cycle 100%: 6000 ±10% RPM | |
Fan Static Pressure | At Duty Cycle 0~20%: 0.68 mm-H2O At Duty Cycle 50%: 5.34 mm-H2O At Duty Cycle 100%: 17.10 mm-H2O | |
Max TDP | 195W | |
Air Flow | At Duty Cycle 0~20%: 21.45 CFM At Duty Cycle 50%: 48.83 CFM At Duty Cycle 100%: 107.25 CFM | |
Noise Level | At Duty Cycle 0~20%: 16.00 dBA At Duty Cycle 50%: 33.20 dBA At Duty Cycle 100%: 50.40 dBA | |
Weight | 539 ± 5 g | |
Fan Dimensions | 92 x 25 mm | |
Action | Select | Select |